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Damage effects in Pyrex by CF4 reactive ion etching in dual RF-microwave plasmas

journal contribution
posted on 2023-06-08, 08:23 authored by D A Zeze, J D Carey, V Stolojan, B L Weiss, S R P Silva
The bonding disruption and thermal damage induced on Pyrex substrates during the reactive ion etching in CF4/Ar and CF4/O-2 dual RF-microwave plasmas is reported. Energy dispersive X-ray and scanning probe analyses indicate that metallic impurities aggregate in clusters of different atomic abundance. These clusters are shown to disrupt the homogeneity and contribute to a non-uniform etching of the substrates. The surface morphology, chemical composition and etching rate are shown to vary with the substrate impedance. Furthermore, the edge effects, local elemental composition, free radical permeation and extended exposure to microwave power are believed to induce substantial thermal damage.

History

Publication status

  • Published

Journal

Micro and Nano Letters

ISSN

1750-0443

Publisher

Institution of Engineering and Technology

Issue

2

Volume

1

Page range

103-107

Pages

5.0

Department affiliated with

  • Engineering and Design Publications

Full text available

  • No

Peer reviewed?

  • Yes

Legacy Posted Date

2012-02-06

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