Giuseppe Cantarella - official manuscript.pdf (1.37 MB)
Flexible In-Ga-Zn-O based circuits with two and three metal layers: simulation and fabrication study
journal contribution
posted on 2023-06-09, 03:51 authored by G Cantarella, K Ishida, L Petti, Niko Munzenrieder, T Meister, R Shabanpour, C Carta, F Ellinger, G Troster, G A SalvatoreThe quest for high-performance flexible circuits call for scaling of the minimum feature size in Thin-Film Transistors (TFTs). Although reduced channel lengths can guarantee an improvement in the electrical properties of the devices, proper design rules also play a crucial role to minimize parasitics when designing fast circuits. In this letter, systematic Computer-Aided Design (CAD) simulations have guided the fabrication of highperformance flexible operational amplifiers (opamps) and logic circuits based on Indium-Gallium-Zinc-Oxide (IGZO) TFTs. In particular, the performance improvements due to the use of an additional third metal layer for the interconnections has been estimated for the first time. Encouraged by the simulated enhancements resulting by the decreased parasitic resistances and capacitances, both TFTs and circuits have been realized on a free-standing 50µm thick polymide foil using three metal layers. Despite the thicker layer stack, the TFTs have shown mechanical stability down to 5mm bending radii. Moreover, the opamps and the logic circuits have yielded improved electrical performance with respect to the architecture with two metal layers: gainbandwidth- product (GBWP) increased by 16:9%, for the first one, and propagation delay (tpd) decreased by 43%, for the latter one.
History
Publication status
- Published
File Version
- Accepted version
Journal
IEEE Electron Device LettersISSN
0741-3106Publisher
IEEEExternal DOI
Issue
12Volume
37Page range
1582-1585Department affiliated with
- Engineering and Design Publications
Research groups affiliated with
- Sensor Technology Research Centre Publications
Notes
© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.Full text available
- Yes
Peer reviewed?
- Yes
Legacy Posted Date
2016-11-02First Open Access (FOA) Date
2017-10-21First Compliant Deposit (FCD) Date
2016-11-02Usage metrics
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