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Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

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conference contribution
posted on 2023-06-09, 11:30 authored by Tilo Meister, Frank Ellinger, Johann W Bartha, Manfred Berroth, Joachim Burghartz, Martin Claus, Lothar Frey, Alessio Gagliardi, Marius Grundmann, Jan Hesselbarth, Hagen Klauk, Karl Leo, Paolo Lugli, Stefan Mannsfeld, Yiannos Manoli, Renato Negra, Daniel Neumaier, Ullrich Pfeiffer, Thomas Riedl, Susanne Scheinert, Ullrich Scherf, Andreas Thiede, Gerhard Troster, Martin Vossiek, Robert Weigel, Christian Wenger, Golzar Alavi, Markus Becherer, Carlos Alvarado Chavarin, Mohammed Darwish, Martin Ellinger, Chun-Yu Fan, Martin Fritsch, Frank Grotjahn, Marco Gunia, Katherina Haase, Philipp Hillger, Koichi Ishida, Michael Jank, Stefan Knobelspies, Matthias Kuhl, Grzegorz Lupina, Shabnam Mohammadi Naghadeh, Niko Munzenrieder, Sefa Ozbek, Mahsa Rasteh, Giovanni A Salvatore, Daniel Schrufer, Carsten Strobel, Manuel Theisen, Christian Tuckmantel, Holger von Wenckstern, Zhenxing Wang, Zhipeng Zhang
Today, electronics are implemented on rigid substrates. However, many objects in daily-life are not rigid — they are bendable, stretchable and even foldable. Examples are paper, tapes, our body, our skin and textiles. Until today there is a big gap between electronics and bendable daily-life items. Concerning this matter, the DFG Priority Program FFlexCom aims at paving the way for a novel research area: Wireless communication systems fully integrated on an ultra-thin, bendable and flexible piece of plastic or paper. The Program encompasses 13 projects led by 25 professors. By flexibility we refer to mechanical flexibility, which can come in flavors of bendability, foldability and, stretchability. In the last years the speed of flexible devices has massively been improved. However, to enable functional flexible systems and operation frequencies up to the sub-GHz range, the speed of flexible devices must still be increased by several orders of magnitude requiring novel system and circuit architectures, component concepts, technologies and materials.

History

Publication status

  • Published

File Version

  • Accepted version

Journal

2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)

Publisher

IEEE

Page range

1-6

Event name

Microwaves, Antennas, Communications and Electronic Systems (COMCAS), 2017 IEEE International Conference on

Event location

Tel-Aviv, Israel

Event type

conference

Event date

13-15 Nov. 2017

Book title

2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)

Department affiliated with

  • Engineering and Design Publications

Research groups affiliated with

  • Sensor Technology Research Centre Publications

Notes

© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works

Full text available

  • Yes

Peer reviewed?

  • Yes

Legacy Posted Date

2018-01-10

First Open Access (FOA) Date

2018-01-10

First Compliant Deposit (FCD) Date

2018-01-10

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